Biography

Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year he received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.  

Research Interest

Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics; Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs; Probabilistic Methods in Reliability Engineering, Probabilistic Risk Assessment Management; Analytical (Mathematical) Modeling in Applied Science and Engineering Problems; Photonics, Fiber Optics, Mechanics of Optical Fibers; Design for Reliability of Electronic, Opto-Electonic and Photonic Systems; Composite and 'Smart' Materials Systems; Thin Film Mechanics and Physics; Shock and Vibration Analysis Testing; Dynamic Response of Materials and Structures to Shocks and Vibrations; Thermal Stress Analysis and Prediction and Prevention of Thermal Stress Failures; Solder Joint Interconnections; Polymeric Materials in Electronics and Photonics; Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability; Nanotechnologies and Nanomaterials; Stretchable (Large Area) Electonics and Photonics: Physical Design for Reliability; Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations; Technical Diagnostics, Prognostics and Health Monitoring (PHM); Automotive and Aerospace Electronics and Photonics; Vehicular (Aerospace, Maritime, etc.) Missions Success and Safety; 'Human-in-the-loop': Human-Equipment-Environmental Interaction; Avionics Psychology.